- Unique ball mounting method enables fast and stable ball mounting.
- Simple mechanism makes maintenance easy.
- Compatible with silicon wafers and molded wafers.
- Optimized ball loading method realizes waste-free and highly efficient ball usage.
- Compatible with SECS/GEM, OHT, AGV (option)
Features
Specification
| Wafer size | 8, 12 [inch] |
|---|---|
| Ball dia. | φ50 ~ φ300 [μm] |
| Min. ball pitch | 90 [μm] (φ50 [μm] ball) |
| Machine alignment accuracy | ±25 [μm] |
| Dimensions (W x D x H) | 3,595 x 1,650 x 1,650 [mm] |
| Weight | Approx. 2,600 [kg] |
| Loader, unloader | Open cassette, FOUP compatible |
