CB-1800

Bonding
  • Flip Chip Bonder

Features

  1. First COF ultrasonic bonder in the industry to support reel supply.
  2. High throughput with ultrasonic bonding features.
  3. Equipped with automatic head cleaning mechanism.
  4. Dispensing head can be installed as an option before bonding.

Specification

Tape width

35 [mm], 48 [mm], 70 [mm]

Chip size

1×10 ~ 4×25 [mm]

Loading

10 ~ 200 [N]

Mounting accuracy

±3 [μm] (3σ)

Bonding head

Ultrasonic horn (constant heater RT to 250 [℃])

Bonding stage

Constant heater, RT to 150 [℃]

Dimensions (W x D x H)

2,900 × 1,500 × 1,950 [mm]

Weight

Approx. 2,400 [kg]

Contact

If you have any questions, please feel free to contact us.

TEL :0266-53-3369

Contact now