- Extremely low load, high precision bonding
- Real-time control is possible in the low load range, thereby minimizing bump height variation.
- Supports ultrasonic bonding by changing tools
- Processes supported: ACF, ACP, NCF, NCP, Au-Sn (eutectic), Au-Au (ultrasonic), solder bumping
- Various Functions & Options
<Standard Functions>
- Chip flip unit
- Constant heat stage
- ATC (Automatic Ceramic Tool Change)
- Calibration
- Process management (logger/export to other PC)
- Automatic flattening mechanism
- ID reading
<Optional Functions>
- Eutectic head (without heating)
- Purging jig for eutectic
- Eutectic stage (□52mm pulse heater)
- Transfer function (Flux, paste, etc.)
- Dispenser unit (excluding dispenser)
- Die bonder function
- Chip imaging camera
- Gel-Pack©
- Ultrasonic bonding
