This is an OLB integrated line that also supports COF.
Fully-automatic operation from ACF application to large LCD panels to TCP temporary bonding and final bonding.
Underfill material application equipment for reinforcing the connection terminals between the chip and the board after flip chip mounting.
<Reference Specifications>
- Multi-head support for dispensers
- Temperature control of fill agent
- Dispensing needle calibration & cleaning mechanism
- Substrate preheat function
