History

Established with paid-in capital of 200 million yen
Camera lens assembly system launched

New corporate headquarter building and factory completed
Multi-die bonder (MS-3000) launched
TAB cutting system (MS-1700) launched
Inaugural participation in Semicon Japan trade show

COB potting system (MS-1820) launched
IC card test handler launched

Named the trademark " Athlete "
Twin-head TAB potting system (MS-1850T) launched
TAB marking system launched
Eutectic die bonder launched
Flip-chip bonder (CB-1000) sold outside for the first time in industry

Chip bonder for communications LED launched
Man-machine visual interface "MAT" developed
Cell PCB automatic soldering line (MTB-400) sold outside for the first time in industry

ACF application system (MTB-1000) launched

Dual-head TAB potting system (MS-1870D) launched
Cost effective flip-chip bonder (CB-500) developed

Cell-PCB automatic ACF joining system launched
Fully automated ACF flip-chip mounting line (CB-2000) launched
Small-diameter ball mounting system (BA-1000) launched - an industry first

Capital increased to 81.8 million yen
Flip-chip bonder (CB-1700) capable of mass production launched

Microball mounter launched (BM-1000)

Flip-chip bonder (CB-1750) launched
BGA ball mounting system (BA-1100) launched - an industry first

3-syringe TAB potting system (MS-1880DⅢ) launched
BGA ball mounting system with upsized head (BA-1110) launched
Headquarter building doubled in size, clean room and truck yard added

Company renamed as Athlete FA Corporation
Private-placement bonds of 200 million yen issued

Capital increased to 85.8 million yen
Employee Stock Ownership Society established
COF-compatible TAB potting system (MS-1890DⅢ) awarded "Good Design Prize"
Certified to ISO 9001

Ultrasonic bonding system developed
Shanghai Office established
Certified to ISO 14001

Microball mounter developed (BM-1100)
Overseas subsidiary Athlete Automation Equipment (Shanghai) Co.,Ltd. Established

Privately-placed bond worth 300 million yen issued

Microball mounter (BM-1100) got the prize for Promoting Machine Industry hosted by Japan Society for the Promotion of Machine Industry

Certified to ISO 9001 and 14001

Management principle and Management policy established

CSP-capable Microball mounter (BM-4100) launched
Developed ultrasonic reflow oven and exhibited at Semicon Japan show

High speed Pick & Place system AP-1000, Pick & Place with inspection system AP-2000
BM-1100 improved Microball mounter (BM-1300) launched

One-piece substrate- and aggregate substrate-capable BGA/CSP ball mounter (BA-1700) launched
Ultralow load-capable flip-chip bonder (CB-600) launched

A series of laser-marking devices launched

Ag Sinter system launched

Improved version of CB-600 flip-chip bonders (CB-610, CB-620) launched

Improved version of BM-1300 Microball mounter (BM-1400) launched
Desktop flip chip bonder (CB-200) launched

Company building extension work completed
CoS Bonder (CBZ-1000) launched

Athlete FA second factory completed

One-piece substrate-capable Microball mounter (BM-3500SI) launched
High Accuracy die bonder (AB-1000) launched