- High-speed inspection of ball “missing,” ” extra,” and “shift” by dual inspection cameras
- Two types of repairs are available
- Missing balls: Flux application and ball mounting
- Excess ball: Absorption and removal
- Automatic calibration function
- SECS/GEM, OHT and AGV are supported (optional)
Features
Specification
| Wafer size | 8, 12 [inch] |
|---|---|
| Ball dia. | φ50 ~ φ300 [μm] |
| Min. ball pitch | 90 [μm] (φ50 [μm] ball) |
| Machine alignment accuracy | ±15 [μm] |
| Dimensions (W x D x H) | 3,065 x 1,700 x 1,650 [mm] |
| Weight | Approx. 2,900 [kg] |
| Loader, unloader | Open cassette, FOUP compatible |
