- Achieves mounting cycle time of 2 seconds (*excluding process).
- Ultrasonic bonding enables highly reliable narrow-pitch bonding at low temperatures.
- Both types of chip trays (2 to 4 inches) and wafers (4 to 8 inches) can be supplied.
Features
Specification
Substrate size (W x L) | 50 × 80 [mm] ~ 80 × 200 [mm] |
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Chip size | 50 × 80 [mm] ~ 80 × 200 [mm] |
Loading | 10 ~ 200 [N] |
Mounting accuracy | ±3 [μm] (3σ) |
Bonding head | Ultrasonic horn (constant heater RT to 250 [℃]) |
Bonding stage | Constant heater RT to 150 [℃] |
Dimensions (W x D x H) | 1,320 × 1,800 × 1,780 [mm]*Loader and unloader not included |
Weight | Approx. 2,400 [kg] |