CB-200/210

Bonding

Features

Substrate size (W x L)	10 × 10 ~ 150 × 300 [mm]
Chip size	□0.8 ~ 30 [mm]
Loading	1 ~ 100 [N]
Mounting accuracy	High precision mode: ±2 [μm] (3σ) Normal mode: ±5 [μm] (3σ)
Cycle time	High precision mode: 10 [sec/chip] Normal mode: 6 [sec/chip]
Stage temperature	CB-200: RT ~ 50 [℃] CB-210: RT ~ 250 [℃]
Power supply	CB-200: 100 [V] CB-210: 200 [V]
Dimensions (W x D x H)	Main body: 702 × 805 × 740［mm] Controler box: 746 × 350 × 510 [mm]
Weight	Main body: Approx. 120 [kg] Controler box: Approx. 50 [kg]

If you have any questions, please feel free to contact us.