- High-precision mounting XY±5[μm] 3σ (θ±1°)
- Compatible with small and thin chips
- Calibration
- Traceability function provided
Features
Specification
| Substrate supply form | 8, 12 [inch] Wafer |
|---|---|
| Die size (board side) | Maxi. □2.5 [mm] |
| Chip supply form | 6, 8 [inch] Wafer |
| Chip size | □0.15 ~ □1 [mm] |
| Loading | 0.2 ~ 1 [N] |
| Mounting accuracy | XY±5 [μm] 3σ(θ±1°) |
| Dimensions (W x D x H) | 1,600 x 1,920 × 1,700 [mm] |
