- Solder Die Bonder enabling mounting of power semiconductors and optical communication devices.
- High-precision mounting under temperature (up to 400 [℃]) conditions.
- Bonding under oxygen concentration control to prevent solder oxidation (oxygen concentration 500ppm or less).
- Supports temperature control for each process zone (pre/main/after).
- Capable of supplying solder in various shapes (paste/ribbon).
Features
Specification
| Substrate supply form | Transfer carrier or direct transfer Depends on substrate shape and size |
|---|---|
| Solder supply form | Pre-form solder (ribbon solder) |
| Chip supply form | Chip trays (stacked) |
| Loading | Solder mounting head: 1 [N] |
| Bonding head | Max. 400 [°C] (constant heat method) |
| Substrate supply form | Substrate transfer carrier or direct transfer |
| Cycle time | 5 [sec/chip] |
| Loader, unloader | Magazine supply / storage |
| Mounting accuracy | ±50 [μm] |
| Dimensions (W x D x H) | 3,700×1,350×1,650 [ mm] |
| Weight | 3,500 [kg] |
